MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...

Every cutting-edge AI accelerator, whether it carries an NVIDIA, AMD, or custom hyperscaler logo, must pass through a step ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

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In May 2026, Applied Materials, Inc. reported second‑quarter 2026 sales of US$7.91 billion and net income of US$2.81 billion, ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits — tiny chips that convey information using light instead of ...

Leading contract chip manufacturer Taiwan Semiconductor Manufacturing ( TSM 1.31%) estimates the semiconductor market will reach $1.5 trillion by 2030, roughly double the amount spent in 2025. That's ...