Business Wire

Astera Labs First to Break Through the Memory Wall with Industry’s Highest Performance ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Astera Labs, the global leader in semiconductor-based connectivity solutions for AI infrastructure, today announced that its Leo Memory Connectivity Platform ...
Business Wire

Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP

SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry’s leading HBM4E Memory Controller IP, ...
SiliconANGLE

Rambus targets AI memory bottlenecks with new HBM4E controller IP

Chip and silicon intellectual property technology company Rambus Inc. today announced HBM4E Memory Controller IP, a new solution that delivers breakthrough performance with advanced reliability ...
Semiconductor Engineering

HBM4E Raises The Bar For AI Memory Bandwidth

The pace of AI innovation continues to expose a painful reality. Compute keeps scaling, but memory bandwidth remains one of the hardest bottlenecks to remove. As AI models grow larger and more complex ...
EDN

CXL: The key to memory capacity in next-gen data centers

We’re on the verge of a new era of computing that will likely see major changes to the data center, thanks to the growing dominance of artificial intelligence (AI) and machine learning (ML) ...
Semiconductor Engineering

Controlled Shared Memory For Dynamically Controlling Data Communication Via Shared Memory ...

A new technical paper titled “Controlled Shared Memory (COSM) Isolation: Design and Testbed Evaluation” was published by researchers at Arizona State University and Intel Corporation. “Recent memory ...