Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

WEST LAFAYETTE, Ind. – Purdue University researchers have developed a large-scale manufacturing process that may change the way some grocery store foods are packaged. According to Credence Research, ...

New flexible packaging films have a unique combination of performance, durability and easy scalability to help strengthen the broader recycling ecosystem, paving the way for stronger, cleaner ...

Processing and packaging have long been treated as two different worlds, walled off from each other by the obvious differences in the two functions. However, a growing number of industry professionals ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

The scientists used sliced bologna tainted with Listeria monocytogenes, packaged it in vacuum-sealed plastic bags, and then submerged the packages in hot water, said lead researcher Tim Haley of ...