The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

The overall concept of reflow soldering is simple: put a pre-assembled board with some solder paste into an oven and bake it until the solder properly melts. When a board is reflowed, it typically is ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...