Abstract: This paper presents a 3D model of a photoconductive antenna (PCA) on semiconductor substrate. The simulations were conducted using the COMSOL Multiphysics package. The model considers the ...

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Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

Silicon carbide (SiC) is the most suitable solution for implementing an FCEV DC-DC converter because of its characteristics of high frequency, high voltage withstands, low conductivity, and low ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO:6503) announced today that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter ...

COMSOL, the leading provider of software solutions for multiphysics modeling has released version 6.0 of the COMSOL Multiphysics® software. The release introduces the Model Manager, a new workspace in ...

India-based Polymatech Electronics announced it had begun manufacturing Opto-semiconductors and memory modules in its Tamil Nadu plant, a leap for India to build a self-reliant semiconductor ecosystem ...

Alpha and Omega Semiconductor (AOS), a designer, developer, and global supplier of a broad range of power semiconductors, power ICs, and digital power products announced the release of an integrated ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its new SLIMDIP-X power semiconductor module, which achieves low thermal resistance and noise for use in home ...